SiCSem to Lay Foundation Stone for Second Semiconductor Unit in Odisha on November 1
In a major boost to Odisha’s semiconductor ambitions, SiCSem Pvt Ltd, a subsidiary of Archean Chemical Industries Ltd, is set to lay the foundation stone for its second semiconductor manufacturing unit in the state on November 1.
According to official sources, IDCO has allotted 23 acres of land at Info Valley for the upcoming compound semiconductor facility. SiCSem is one of the two projects approved under the India Semiconductor Mission (ISM) for Odisha.
The state’s first semiconductor unit, RIR Power Electronics Ltd, has already begun construction on its ₹620 crore silicon carbide manufacturing facility at the same park — the first of its kind in India.
SiCSem’s new unit will involve an investment of ₹2,067 crore to set up a compound semiconductor manufacturing plant capable of processing 60,000 SiC wafers annually and packaging around 96 million MOSFETs and Diodes. The facility will cater to key sectors such as electric vehicles (EVs), renewable energy, and smart grid systems.
The project is expected to generate around 1,000 direct jobs and numerous indirect employment opportunities through the growth of ancillary industries and service networks, strengthening Odisha’s position as an emerging semiconductor hub and driving the ESDM (Electronic System Design and Manufacturing) ecosystem.
To promote research and innovation, SiCSem has already established an R&D Centre — SICRIC — at IIT Bhubaneswar, with an investment of ₹64 crore. The center, inaugurated during the Utkarsh Odisha Conclave in January this year, focuses on advancing indigenous silicon carbide (SiC) technology.
The company’s leadership team, including Ranjit Pendurthi, Managing Director of Archean Chemical Industries Ltd, recently met Chief Minister Mohan Charan Majhi during Semicon India 2025 in Delhi to discuss the project’s implementation roadmap.
The foundation stone ceremony will be attended by Chief Minister Mohan Charan Majhi and Union Minister for Electronics and Information Technology Ashwini Vaishnaw.
In addition to SiCSem, US-based 3D Glass Solutions (3DGS) Inc will also set up an advanced packaging and embedded glass substrate unit at Info Valley-II, with an investment of ₹1,943 crore, further bolstering Odisha’s position as a rising center for semiconductor and ESDM innovation.
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